Journal of Microelectronics and Electronic Packaging
International Microelectronics And Packaging Society · United States
Metrics
- SJR
- 0.235Q3 SCImago
- h-index
- 22
- Citations per paper
- 1.11 last 2 years
- Articles per year
- 6
- Fee (APC), est.
- $2,491 estimated, check the journal
About this journal
- ISSN
- 1551-4897 (print) · 1555-8037 (online)
- Publisher
- International Microelectronics And Packaging Society
- Country
- United States · Northern America
- Access
- Subscription · 0% gold OA
- Original research
- 0%
- Subject areas
- Computer Science, Engineering, Materials Science
- Categories
- Engineering, Electrical and Electronic Engineering
- Common topics
- Engineering, Physics, Materials science, Electrical engineering, Composite material
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Figures as of the last import; ranks are a guide, not a verdict. Back to all journals